Part Number
|
GS816136DT-xxxV |
Manufacturer
|
GSI Technology |
Description
|
18Mb Sync Burst SRAMs |
Published
|
May 29, 2019 |
Detailed Description
|
GS8161xxD(GT/D)-xxxV
100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp
1M x 18, 512K x 32, 512K x 36 18Mb Sy...
|
Datasheet
|
GS816136DT-xxxV
|
Overview
GS8161xxD(GT/D)-xxxV
100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp
1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs
333 MHz–150 MHz
2.
5 V or 3.
3 V VDD 2.
5 V or 3.
3 V I/O
Features
• IEEE 1149.
1 JTAG-compatible Boundary Scan • 1.
8 V or 2.
5 V core power supply • 1.
8 V or 2.
5 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 165-bump BGA package • RoHS-compliant 100-pin TQFP and 165-bump BGA packages
available
Functional Description
Applications The G...
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