Part Number
|
GS816273CC |
Manufacturer
|
GSI Technology |
Description
|
18Mb S/DCD Sync Burst SRAMs |
Published
|
May 29, 2019 |
Detailed Description
|
GS816273CC-333/300/250
209-Bump BGA Commercial Temp Industrial Temp
256K x 72 18Mb S/DCD Sync Burst SRAMs
333 MHz–250...
|
Datasheet
|
GS816273CC
|
Overview
GS816273CC-333/300/250
209-Bump BGA Commercial Temp Industrial Temp
256K x 72 18Mb S/DCD Sync Burst SRAMs
333 MHz–250 MHz 3.
3 V or 2.
5 V VDD 3.
3 V or 2.
5 V I/O
Features
• Single/Dual Cycle Deselect selectable • IEEE 1149.
1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 3.
3 V or 2.
5 V core power supply • 3.
3 V or 2.
5 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to SCD x18/x36 Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 209-bump...
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