GS82583ET18/36GK-675/625/550/500 260-Pin BGA Commercial Temp Industrial Temp 288Mb SigmaDDR-IIIe™ Burst of 2 SRAM Up to 675 MHz 1.
3V VDD 1.
2V, 1.
3V, or 1.
5V VDDQ Features • 8Mb x 36 and 16Mb x 18 organizations available • 675 MHz maximum operating frequency • 675 MT/s peak transaction rate (in millions per second) • 48 Gb/s peak data bandwidth (in x36 devices) • Common I/O DDR Data Bus • Non-multiplexed SDR Address Bus • One operation - Read or Write - per clock cycle • Burst of 2 Read and Write operations • 3 cycle Read Latency • 1.
3V nominal core voltage • 1.
2V, 1.
3V, or 1.
5V HSTL I/O interface • Configurable ODT (on-die termination) • ZQ pin for programmable driver impedance • ZT pin ...

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