IGBT Chip in NPT-technology FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling SIGC42T60SNC This chip is used for: • IGBT-Modules Applications: • drives C G E Chip Type SIGC42T60SNC SIGC42T60SNC VCE ICn Die Size 600V 50A 6.
5 x 6.
5 mm2 600V 50A 6.
5 x 6.
5 mm2 Package Ordering Code sawn on foil unsawn Q67050-A4181A001 Q67050-A4181A002 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 6.
5 x 6.
5 mm2...

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