IGBT Chip in NPT-technology FEATURES: • 600V NPT technology • 100µm chip • short circuit prove • positive temperature coefficient • easy paralleling SIGC03T60SNC This chip is used for: • IGBT Modules Applications: • drives C G E Chip Type SIGC03T60SNC VCE ICn 600V 2A Die Size 1.
78 x 1.
78 mm2 Package Ordering Code sawn on foil Q67041-A3000A002 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 1.
78 x 1.
78 mm2 3.
2 / 1.
7 1.
1 x 1.
1 (L-shaped) 0.
5...

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