SIDC78D170H Fast switching diode chip in EMCON 3 -Technology FEATURES: • 1700V EMCON 3 technology 200 µm chip This chip is used for: • soft, fast switching • EUPEC power modules A • low reverse recovery charge • small temperature coefficient Applications: • resonant applications, drives C Chip Type SIDC78D170H VR IF Die Size Package Ordering Code 1700V 150A 7.
35 x 10.
65 mm2 sawn on foil Q67050-A4177A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Anode metallization Cathode metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 7.
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