SIDC59D170H Fast switching diode chip in EMCON 3 -Technology FEATURES: A • 1700V EMCON 3 technology 200 µm chip This chip is used for: • soft, fast switching • EUPEC power modules • low reverse recovery charge • small temperature coefficient Applications: C • resonant applications, drives Chip Type SIDC59D170H VR IF Die Size 1700V 100A 7.
7 x 7.
7 mm2 Package Ordering Code sawn on foil Q67050-A4176A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Anode metallization Cathode metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 7.
7 x ...

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