SIDC02D65C8 Fast switching diode chip in EMCON 3 -Technology Recommended for: A Features: • Power module • 650V EMCON 3 technology 65 µm chip • Discrete components • Soft, fast switching • Low reverse recovery charge C • Small temperature coefficient Applications: • Qualified according to JEDEC for target • Drives applications • White goods • Resonant applications Chip Type VR I 1) Fn Die Size Package SIDC02D65C8 650V 6A 1.
4 x 1.
65 mm2 sawn on foil 1 ) nominal forward current at Tc = 100°C, not subject to production test - verified by design/characterisation Mechanical Parameters Die size Area total Anode pad size Thickness Wafer size Max.
possible chips per wafer Pa...

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