Features • • • • • • • • • • • • Sensitive Layer Over a 0.
8 µm CMOS Array Image Zone: 0.
4 x 14 mm = 0.
02" x 0.
55" Image Array: 8 x 280 = 2240 pixels Pixel Pitch: 50 µm x 50 µm = 500 dpi Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second Die Size: 1.
7 x 17.
3 mm Operating Voltage: 3V to 5.
5V Naturally Protected Against ESD: 16 kV Air Discharge Power Consumption: 20 mW at 3.
3V, 1 MHz, 25°C Operating Temperature Range: 0°C to +70°C: C suffix Resistant to Abrasion: 1 Million Finger Sweeps Chip-On-Board (COB) package or 20-lead Ceramic DIP available for development, with Specific Protective Layer Applications • • • • • • • • • PDA (Access Control, Data Protection) Cellular Phones, ...

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