Part Number
|
WEDPNF8M721V-1215BI |
Manufacturer
|
ETC |
Description
|
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package |
Published
|
Apr 17, 2005 |
Detailed Description
|
White Electronic Designs
WEDPNF8M721V-XBX
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED*...
|
Datasheet
|
WEDPNF8M721V-1215BI
|
Overview
White Electronic Designs
WEDPNF8M721V-XBX
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED*
FEATURES
n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.
5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode.
• Any combination of sectors can be concurrently erased.
Also supports full chip erase Boot Code Sector Architecture (Bottom) Embedded Erase and Program Algorithms Erase Suspend/Resume • Supports reading data from...
Similar Datasheet