Part Number
|
APD032 |
Manufacturer
|
Etc |
Description
|
PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS |
Published
|
Apr 23, 2005 |
Detailed Description
|
INTRODUCTION
PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS
1. Parameter Definitions:
A = Distance from top of chip to...
|
Datasheet
|
APD032
|
Overview
INTRODUCTION
PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS
1.
Parameter Definitions:
A = Distance from top of chip to top of glass.
a = Photodiode Anode.
B = Distance from top of glass to bottom of case.
c = Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted).
W = Window Diameter.
F.
O.
V.
= Filed of View (see definition below).
2.
Dimensions are in inches (1 inch = 25.
4 mm).
3.
Pin diameters are 0.
018 ± 0.
001" unless otherwise specified.
4.
Tolerances (unless otherwise noted) General: 0.
XX ± 0.
01" 0.
XXX ± 0.
005" ± 0.
010" ± 0.
015"
Chip Centering: Dimension `A': 5.
Windows
All `UV' Enhanced products are provided with QUARTZ glass windows, 0...
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