Part Number
|
DIP20 |
Manufacturer
|
ETC |
Description
|
Thermal Data |
Published
|
Jun 3, 2005 |
Detailed Description
|
®
Thermal Data
DIP 20
20 leads PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W...
|
Datasheet
|
DIP20
|
Overview
®
Thermal Data
DIP 20
20 leads PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C
leadframe die attach
copper epoxy glue ( silver glue ) epoxy resin
0.
25 mm 10-40 µm
molding compound
3 mm
0.
0063W/cm°C
Typical assembly configuration before molding :
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size
February 1998 1/2
Thermal Data
DIP 20
Rth(j-a) (ºC/W)
120
copper frame thickness = 0.
25 mm die pad = 125 x 160 sq.
mils die size = 10.
000 sq.
mils
1)
100
floating in air
80
mounted on board
60
0
0.
2
0.
4
0.
6
0.
8
1 1.
2 1.
4 1.
6 dissipated power ( Watt )
1.
8
2
2.
2
2.
4
Transient Thermal Resista...
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