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Part Number
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HF70D120ACE |
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Manufacturer
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International |
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Description
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Haxfred Die in Wafer Form |
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Published
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Jun 18, 2005 |
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Detailed Description
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HF70D120ACE
Features
GEN3 Hexfred Technology Low VF Low IRR Low tRR Soft Reverse Recovery Benchmark Ef...
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Datasheet
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HF70D120ACE
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Overview
HF70D120ACE
Features
GEN3 Hexfred Technology Low VF Low IRR Low tRR Soft Reverse Recovery Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation
PD - 93878
Hexfred Die in Wafer Form
1200V IF(nom)=75A VF(typ)= 1.
75V @ IF(nom) @ 25°C Motor Control Antiparallel Diode 125mm Wafer
Benefits
Electrical Characteristics (Wafer Form)
Parameter VF BVR IRM Description Forward Voltage Drop Reverse Breakdown Voltage Reverse Leakage Current Guaranteed (min, max) 0.
99V min,1.
31V max 1200V min 30µA max Test Conditions IF = 10A, TJ = 25°C TJ = 25°C, IR = 500µA TJ = 25°C, VR = 1200V
Mechanical Data
Nominal ...
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