MOTOROLA SEMICONDUCTOR TECHNICAL DATA Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit.
The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.
This new chip carrier package uses Motorola’s unique sensor die with its patented, piezoresistive implant technology, along with the added feature of on–chip, thin–film temperature compensation and calibration.
Features: • Low Cost • Patented piezoresistive strain gauge implant, temperature compensat...

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