( DataSheet : www.
DataSheet4U.
com ) PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 37 25 24 ZE A e Eh w M θ bp pin 1 index 48 1 w M 12 ZD v M A 13 detail X Lp L E HE A A2 A1 (A 3) bp e D HD B v M B 0 2.
5 scale 5 mm DIMENSIONS (mm are the original dimensions) A UNIT max.
mm 1.
2 A1 0.
15 0.
05 A2 1.
05 0.
95 A3 0.
25 bp 0.
27 0.
17 c 0.
20 0.
09 D(1) 7.
1 6.
9 Dh 3.
6 3.
4 E(1) 7.
1 6.
9 Eh 3.
6 3.
4 e 0.
5 HD 9.
1 8.
9 HE 9.
1 8.
9 L 1 Lp 0.
75 0.
45 v 0.
2 w 0.
08 y 0.
08 ZD(1) ZE(1) 0.
9 0.
6 0.
9 0.
6 θ 7° 0° Note 1.
Plastic or metal protrusions of 0.
25 ...

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