Part Number
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M6MGD13TW66CWG-P |
Manufacturer
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Renesas Technology |
Description
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CMOS FLASH MEMORY |
Published
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Dec 31, 2006 |
Detailed Description
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com
Preliminary
Notice: This is not a final specification. Some parametric limits are subject to change...
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Datasheet
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M6MGD13TW66CWG-P
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Overview
com
Preliminary
Notice: This is not a final specification.
Some parametric limits are subject to change.
Renesas LSIs
M6MGD13TW66CWG-P
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package)
Description
The M6MGD13TW66CWG-P is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and 64M-bit Mobile RAM in a 72-pin Stacked CSP with leaded solder ball.
128M-bit Flash memory is a 8,388,608 words, single power supply and high performance non-volatile memory fabricated by CMOS technology for the peripheral circuit and DINOR IV (Divided bit-line NOR IV) architec...
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