www.
DataSheet4U.
com SIGC20T120L IGBT Chip FEATURES: • 1200V Trench + Field Stop technology • 120µm chip • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module C Applications: • drives G E Chip Type SIGC20T120L VCE 1200V ICn 15A Die Size 4.
41 x 4.
47 mm2 Package sawn on foil Ordering Code Q67050A4268-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 4.
41 x 4.
47 ...

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