Part Number
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SIGC54T60R3 |
Manufacturer
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Infineon Technologies |
Description
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IGBT |
Published
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Sep 15, 2007 |
Detailed Description
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com
SIGC54T60R3
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off...
|
Datasheet
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SIGC54T60R3
|
Overview
com
SIGC54T60R3
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
3
This chip is used for: • power module
C
Applications: • drives
G
E
Chip Type SIGC54T60R3
VCE 600V
ICn 100A
Die Size 5.
97 x 8.
97 mm2
Package sawn on foil
Ordering Code Q67050A4341-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage environment 5.
97 x 8.
9...
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