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BDTC-800-1A 8 AMP SILICON BRIDGE RECTIFIERS FEATURES MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical 2%, Max.
10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE d H b F8G CED 687 9¡@ SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 MILLIMETERS MIN 2.
5 0.
6 7.
3 9.
8 0.
9 29.
7 3.
6 4.
4 19.
7 13.
2 3.
8 10.
8 3.
1 MAX 2.
9 0.
8 7.
7 10.
2 1.
1 30.
3 4.
0 4.
8 20.
3 13.
8 4.
2 11.
...

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