Production Process InGaP HBT Foundry Service Features Metal 2 - 4um TQHBT • • • • • Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um com B C B C NiCr MIM Metal 0 Base Collector • Sub Collector Isolation Implant Buffer & Substrate • • • • • • • TQHBT Process Cross-Section General Description TriQuint’s TQHBT process is a highly reliable InGaP HBT process with three levels of interconnecting metal.
Thick metal interconnects and high quality passives promote integration.
The thick metal interconnects, which promote enhanced thermal management, and high density capacitors keep die sizes small.
MOCVD epitaxial processes are utilized to grow the active lay...

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