New Product MUH1PB thru MUH1PD Vishay General Semiconductor Surface Mount Ultrafast Rectifiers FEATURES eSMP TM Series • Very low profile - typical height of 0.
65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View MicroSMP PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 1.
0 A IR TJ max.
1.
0 A 100 V, 150 V, 200 V 10 A 25 ns 0.
82 V 1 µA 175 °C • Solder dip 265 °C max.
10 s, per JESD 22-A111 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according...

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