SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev.
3.
0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1.
General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.
2.
Ordering information Table 1.
Ordering information Package Name Description Bumped die on sawn wafer on UV-tape Odering code Type number SL2ICS2001DW/V1D 9352 795 61005 3.
Mechanical specification 3.
1 Wafer • Diameter: • Thickness: 3.
2 Wafer backside • Material: • Treatment: • Roughness:...

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