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Part Number
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WCMC2016V1X |
|
Manufacturer
|
Weida Semiconductor |
|
Description
|
128K x 16 Pseudo Static RAM DIE |
|
Published
|
Jan 31, 2010 |
|
Detailed Description
|
ADVANCE INFORMATION
General Physical Specification
WCMC2016V1X
128K x 16 Pseudo Static RAM DIE
Substrate Connection Re...
|
|
Datasheet
|
WCMC2016V1X
|
Overview
ADVANCE INFORMATION
General Physical Specification
WCMC2016V1X
128K x 16 Pseudo Static RAM DIE
Substrate Connection Req.
: Ground Wafer Diameter [mm]: 200.
00 Die Size [µm]: 4010.
74 x 1565.
84 Step Size [µm]: 4095.
44 x 1650.
89 Scribe Size [µm]: 84.
70 x 84.
94 Pad Count: 64 Pad Size [µm]: 73.
6 x 73.
6
For product parameters and availability, please refer to the WCMC2016V1X product datasheet available on the Cypress Semiconductor Website (http://www.
cypress.
com).
Mfg Part Number: GC2016V5A Die Part Number: Die Technology: PowerChip 0.
165 µm Metal I: 420 nm TiN/AlCu Metal II: 880 nm TiN/Ti/AlCu/TiN Metal III: None Die Passivation: 780nm P-Si3N4 + Polyimide
Product Thickness Guide
Code XW XW14 XW...
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