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Part Number
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CSOIC |
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Manufacturer
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Amkor Technology |
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Description
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Ceramic Small Outline Integrated Circuit Package |
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Published
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Mar 9, 2010 |
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Detailed Description
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data sheet
Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC packag...
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Datasheet
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CSOIC
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Overview
data sheet
Ceramic Small Outline Integrated Circuit Package (CSOIC) This is a ceramic version of the Plastic SOIC package.
The CSOIC is a hermetic package consisting of a multilayer ceramic surrounding a "gullwing" formed leadframe.
This package has leads extending from two sides of the package (dual).
The package is hermetically solder sealed at 325° Centigrade.
These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to ALL SMT processes and lines.
Ceramic SOIC packages provide component and packaging engineers the ability and freedom to optimize systems and product designs.
Applications: End products range from consumer (audio, v...
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