Part Number
|
SDIP30 |
Manufacturer
|
STMicroelectronics |
Description
|
SDIP30 Thermal Data |
Published
|
Mar 20, 2010 |
Detailed Description
|
Thermal Data
SDIP 30
com
30 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conducti...
|
Datasheet
|
SDIP30
|
Overview
Thermal Data
SDIP 30
com
30 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.
25 mm 10-40 µm
molding compound
3.
8 mm
0.
0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time
September 1999
1/2
Thermal Data
SDIP 30
com
Rth(j-a) (ºC/W) 75
1)
70
die size 160x80 sq.
mils mounted on a low K board (1s 1 Oz.
)
80x80 sq.
mils dissipating area
65
60
80x160 sq.
mils dissipating area
55 0 0.
5 1 1.
5 dissipated power ( Watt ) 2 2.
5
Zth( ºC/W)
2)
10
die size 160x80 sq.
mils 80x80 sq.
mils dissipating area...
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