Preliminary GS8662S08/09/18/36E-333/300/250/200/167 www.
DataSheet4U.
com 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Write SigmaSIO™ Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface • Byte Write controls sampled at data-in time • DLL circuitry for wide output data valid window and future frequency scaling • Burst of 2 Read and Write • 1.
8 V +100/–100 mV core power supply • 1.
5 V or 1.
8 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ mode pin for programmable output drive strength • IEEE 1149.
1 JTAG-compliant Boundary Scan • Pin-compatible with future 144Mb devices • 165-bump, 15 mm x 17...

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