Part Number
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M30W0R6500T0 |
Manufacturer
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ST Microelectronics |
Description
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Multi-Chip Package |
Published
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Jun 17, 2010 |
Detailed Description
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com
M30W0R6500T0
96 Mbit (64 + 32Mb, x16, Multiple Bank, Burst, Flash Memories) 1.8V Supply, Multi-Chip...
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Datasheet
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M30W0R6500T0
|
Overview
com
M30W0R6500T0
96 Mbit (64 + 32Mb, x16, Multiple Bank, Burst, Flash Memories) 1.
8V Supply, Multi-Chip Package
FEATURES SUMMARY
■
■
■ ■
■
MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 32 Mbit (2Mb x 16) Flash Memory SUPPLY VOLTAGE – VDDF1 = VDDF2 = VDDQ = 1.
7 to 2.
2V – VPP = 12V for fast Program (optional) LOW POWER CONSUMPTION ELECTRONIC SIGNATURE – Manufacturer Code: 20h – 64Mb Device Code (Top Configuration): 8810h – 32Mb Device Code (Top Configuration): 8814h PACKAGE – Compliant with Lead-Free Soldering Processes – Lead-Free Versions
Figure 1.
Packages
FBGA
Stacked LFBGA88 (ZA) 8 x 10mm
FLASH MEMORY ■ SYNCHRONOUS / ASYNCHRONOUS READ – ...
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