HSP053-4M5 4-line ESD protection for high speed lines Datasheet - production data µQFN-5L package Features  Very compact 500 µm pitch package, for easy PCB layout  Ultra-large bandwidth: 18 GHz  Ultra-low capacitance: 0.
15 pF (I/O to I/O) and 0.
25 pF (I/O to GND)  Low leakage current: 1 nA  Extended operating junction temperature range: -40 °C to 150 °C  Thin package: 0.
4 mm max.
 RoHS compliant Benefits  High ESD protection level  High integration  Suitable for high density boards Complies with the following standards  MIL-STD 883G method 3015-7 class 3B 8 kV  Exceeds IEC61000-4-2 level 4  ±10 kV (contact discharge)  ±25 kV (air discharge) Applications The HSP053-4M5 i...

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