Small Signal Transistor NPN - Silicon Darlington Transistor Chip
PROCESS Small Signal Transistor CP327V NPN - Silicon Darlington Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 33,085 PRINCIPAL DEVICE TYPES CMLT6427E CMST6427E EPITAXIAL PLANAR 23 x 23 MILS 7.1 MILS 4.7 x 4.7 MI...
Central Semiconductor