CP741V

PROCESS Small Signal Transistors CP741V PNP - Low VCE(SAT) Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 54,330 PRINCIPAL DEVICE TYPES CMLT7410 CMPT7410 CMST7410 CMUT7410 EPITAXIAL PLANAR 17...