Part Number
|
MB1608300Y5x |
Manufacturer
|
ABC Taiwan Electronics |
Description
|
MULTILAYER CHIP BEAD |
Published
|
Jun 5, 2011 |
Detailed Description
|
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 1
MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G
A
ABC'S DWG NO....
|
Datasheet
|
MB1608300Y5x
|
Overview
SPECIFICATION FOR APPROVAL
REF : PROD.
NAME PAGE: 1
MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G
A
ABC'S DWG NO.
ABC'S ITEM NO.
MB1608□□□□5□
¢¹¡O
www.
DataSheet4U.
com
D
D
C
B
I
G PCB Pattern
I Unit : m/m
Series MB1608
A 1.
60±0.
15
B 0.
80±0.
15
C 0.
80±0.
15
D 0.
30±0.
20
G 0.
7
H 0.
7
H I 0.
7
¢º¡O
SCHEMATIC DIAGRAM ¡G
¢»¡O
MATERIALS ¡G
a¡ b¡ c¡ d¡ Body O Ferrite ¡ G G Internal conductor O Silver or Ag / Pd ¡ Remark O Lead¡ content G 1600ppm typ.
include ferrite
a
b
c
Terminal electrode O Ag/Ni/Sn (Lead¡ contant 100ppm max.
) G
¢¼¡O
GENERAL SPECIFICATION ¡G
a¡ b¡ c¡ Storage temp.
O -40 ---- +105 ¡ ¡ F Type MB1608 d¡ Solderability O F ( kgf ) 0.
5 time ( sec )
Temperat...
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