Part Number
|
GS8170DW72AC-250 |
Manufacturer
|
GSI Technology |
Description
|
(GS8170DW36AC / GS8170DW72AC) Double Late Write SigmaRAM |
Published
|
Apr 20, 2012 |
Detailed Description
|
GS8170DW36/72AC-350/333/300/250
209-Bump BGA Commercial Temp Industrial Temp Features
• Double Late Write mode, Pipeline...
|
Datasheet
|
GS8170DW72AC-250
|
Overview
GS8170DW36/72AC-350/333/300/250
209-Bump BGA Commercial Temp Industrial Temp Features
• Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.
8 V +150/–100 mV core power supply • 1.
8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.
1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices • Pb-Free 209-bump BGA ...
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