GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.
8 V +150/–100 mV core power supply • 1.
8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.
1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices 18Mb Σ1x1Lp CMOS I/O Late Writ...

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)