Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1: PoP Block Diagram • Micron® NAND Flash and Mobile LPDRAM components • RoHS-compliant, “green” package • Separate NAND Flash and Mobile LPDRAM interfaces • Space-saving package-on-package combination • Low-voltage operation (1.
70–1.
95V) • Industrial temperature range: –40°C to +85°C NAND Flash Power NAND Flash Device NAND Flash Interface NAND Flash-Specific Features • Organization – Page size x8: 2112 bytes (2048 + 64 bytes) x16:...

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)