|
Part Number
|
LQFP44 |
|
Manufacturer
|
Philips |
|
Description
|
PC board footprint |
|
Published
|
Apr 22, 2014 |
|
Detailed Description
|
Philips Semiconductors
PC board footprint
Footprint information for reflow soldering of LQFP44 package
SOT389-1
Hx G...
|
|
Datasheet
|
LQFP44
|
Overview
Philips Semiconductors
PC board footprint
Footprint information for reflow soldering of LQFP44 package
SOT389-1
Hx Gx P2 P1 (0.
125)
Hy
Gy
By
Ay
C
D2 (8×) Bx Ax Generic footprint pattern
D1
Refer to the package outline drawing for actual layout
solder land occupied area
DIMENSIONS in mm P1 0.
800 P2 Ax Ay Bx By C 1.
500 D1 0.
500 D2 0.
600 Gx Gy Hx Hy
0.
850 13.
300 13.
300 10.
300 10.
300
10.
500 10.
500 13.
550 13.
550
SOT389-1_fp_reflow
© Koninklijke Philips Electronics N.
V.
2004.
All rights reserved.
PDF
29 December 2004
1 of 1
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