Part Number
|
CIM10J121 |
Manufacturer
|
Samsung |
Description
|
Chip Bead |
Published
|
Dec 2, 2014 |
Detailed Description
|
Chip Bead For EMI Suppression
201208
CIB/CIM10 Series (1608/ EIA 0603)
APPLICATION
High frequency EMI prevention appl...
|
Datasheet
|
CIM10J121
|
Overview
Chip Bead For EMI Suppression
201208
CIB/CIM10 Series (1608/ EIA 0603)
APPLICATION
High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones.
FEATURES
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or
reflow soldering Monolithic inorganic material construction for high reliability Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.
DIMENSION
RECOMMENDED LAND PATTERN
0.
6~0.
8mm
0.
6~0.
8mm
0.
6~0.
8mm
0.
6~0.
8mm
Type
Dimension [mm] LW t d
10 1.
6±0.
15 0.
8±0.
15 0.
8±0.
15 0.
3±0.
2
DESCRIPTION
Part no.
CIB10P100 CIB10P220 CIB10P260...
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