IGC07T120T6L IGBT4 Low Power Chip Features: • 1200V Trench + Field stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules Applications: • low / medium power drives C G E Chip Type IGC07T120T6L VCE 1200V ICn 4A Die Size 2.
54 x 2.
72 mm2 Package sawn on foil MECHANICAL PARAMETER Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
pos sible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Recommended storage environment 2.
54 x 2.
72 1.
029 x 1.
248 0.
358 x 0.
514 mm 2 6.
9 / 2.
8 115 µm 150 mm 9...

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