Part Number
|
MADP-042405-13060 |
Manufacturer
|
MA-COM |
Description
|
PIN Diodes |
Published
|
Apr 9, 2016 |
Detailed Description
|
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes: RoHS
Rev. V6
Features
Surface Mount No Wirebonds Required Rug...
|
Datasheet
|
MADP-042405-13060
|
Overview
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes: RoHS
Rev.
V6
Features
Surface Mount No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process.
This device features two silicon pedestals embedded in a low loss, low dispersion glass.
The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive.
Selec...
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