FEATURES • InGaP HBT Technology • -51 dBc ACPR @ 65 MHz, +27 dBm • 30.
5 dB Gain • High Efficiency • Low
Transistor Junction Temperature • Matched for a 50 Ω System • Low Profile Miniature Surface Mount Package;
RoHS Compliant • Multi-Carrier Capability
APPLICATIONS • WCDMA, HSDPA and LTE Air Interfaces • Picocell, Femtocell, Home Nodes • Customer Premises Equipment (CPE) • Data Cards and Terminals
AWB7223
1.
930 -1.
995 GHz Small-Cell Power Amplifier Module
Data Sheet - Rev 2.
1
M52 Package 14 Pin 7 mm x 7 mm x 1.
3 mm
Surface Mount Module
PRODUCT DESCRIPTION The AWB7223 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (...