| Part Number | 25Q32FVSIG |
| Manufacturer | Winbond |
| Title | 3V 32M-BIT SERIAL FLASH MEMORY |
| Description | ....5 2. FEATURES .... |
| Features |
..5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....6
3.1 Pin Configuration SOIC 208-mil / VSOP 208-m... |
| File Size | 2.15MB |
| Datasheet |
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25Q32FVSIQ : W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: October 20, 2015 Revision I W25Q32FV Table of Contents 1. GENERAL DESCRIPTIONS .............................................................................................................5 2. FEATURES .......................................................................................................................................5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ..........................................................................6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil..................................................................6 3.2 Pad Configuration WSON 6x5-mm / .
25Q32FVSIP : W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: October 20, 2015 Revision I W25Q32FV Table of Contents 1. GENERAL DESCRIPTIONS .............................................................................................................5 2. FEATURES .......................................................................................................................................5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ..........................................................................6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil..................................................................6 3.2 Pad Configuration WSON 6x5-mm / .
25Q32FVSIF : W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: October 20, 2015 Revision I W25Q32FV Table of Contents 1. GENERAL DESCRIPTIONS .............................................................................................................5 2. FEATURES .......................................................................................................................................5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ..........................................................................6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil..................................................................6 3.2 Pad Configuration WSON 6x5-mm / .