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• InGaP HBT Technology • High Efficiency: 22 % @ +16 dBm POUT (without DC/DC converter) 40 % @ maximum POUT • Low Quiescent Current: 8 mA • Internal
Voltage Regulation • Common VMODE Control Line • Simplified VCC Bus PCB routing • Reduced External Component Count • Low Profile Surface Mount Package: 1 mm • HSDPA Compliant • RoHS Compliant Package, 250 oC MSL-3
FEATURES
HELP3TM Tri-band US Cellular/Japan Cellular/IMT UMTS/WCDMA Linear Power Amplifier Module
Data Sheet - Rev 2.
1
AWT6222
AW T
622
2
APPLICATIONS
• WCDMA/HSPA JCell/IMT Dual-Band Wireless Handsets and Data Devices
The AWT6222 addresses the demand for increased integration in dual-ban...