PROCESS
CPZ39R
Transient
Voltage Suppressor
5 Volt Quad TVS Chip
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Metalization Back Side Metalization 11 x 11 MILS 3.
94 MILS 3.
54 MILS DIAMETER EACH Al - 30,000Å Au - 9,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 140,490 PRINCIPAL DEVICE TYPE CMNTVS5V0
R0 (22-January 2013)
w w w.
c e n t r a l s e m i .
c o m
http://www.
Datasheet4U.
com
PROCESS
CPZ39R
Typical Electrical Characteristics
R0 (22-January 2013)
w w w.
c e n t r a l s e m i .
c o m
http://www.
Datasheet4U.
com
...