THIN FILM EMSBC SERIES EMSBC SERIES The EMSBC series back contact chip resistor offers a space-saving design in a 0.
020" x 0.
020" size that requires only one wire bond.
The chip backside provides the other contact with eutectic or conductive epoxy attachment to the substrate.
Wire bonding is made to the notched pad on top of the chip.
EMSBC's offer the high stability , low noise, and low T .
C.
R.
of thin film while providing greater flexibility in hybrid stability, T.
C.
R.
designs.
Excellent for use in Vision Recognition Systems.
CHIP RESISTORS MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.
020" x 0.
020" x 0.
010" (±0.
003") SILICON TANT ALUM NITRIDE ANTAL...

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