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M36L0T7050T2 M36L0T7050B2
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
Preliminary Data
Feature summary
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Multi-Chip Package – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32 Mbit (2Mb x16) Pseudo SRAM Supply
voltage – VDDF = 1.
7 to 1.
95V – VCCP = VDDQ = 2.
7 to 3.
1V – VPPF = 9V for fast program Electronic signature – Manufacturer Code: 20h – Device Code (Top Flash Configuration) M36L0T7050T2: 88C4h – Device Code (Bottom Flash Configuration) M36L0T7050B2: 88C5h ECOPACK® packages available
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FBGA
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TFBGA88 (ZAQ) 8 x 10mm
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Block locking – All blocks locked at ...