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MPXC2011DT1


Part Number MPXC2011DT1
Manufacturer Motorola
Title (MPXC2011DT1 / MPXC2012DT1) High Volume Sensor
Description Chip Pak, 1/3 Gel Chip Pak, No Gel Tape Width 24 mm Marking Date Code, Lot ID Date Code, Lot ID Quantity 1000 pc/reel MPXC2011DT1 MPXC2012DT1 Pac...
Features
• Low Cost
• Integrated Temperature Compensation and Calibration
• Ratiometric to Supply Voltage
• Polysulfone Case Material (Medical, Class V Approved)
• Provided in Easy--to--Use Tape and Reel Application Examples
• Respiratory Diagnostics
• Air Movement Control
• Controllers
• Pressure Switching...

File Size 123.59KB
Datasheet MPXC2011DT1 PDF File






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MPXC2011DT1 : Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXC2011DT1 Rev. 11, 09/2015 MPXC2011DT1, 0 to 10 kPa, Differential, Compensated Pressure Sensor Freescale Semiconductor has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. Features • Integrated temperature compensat.




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