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DataSheet4U.
com Freescale Semiconductor Technical Data MPXC2011DT1 Rev.
3, 10/2004 High Volume Sensor for Low Pressure Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit.
The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.
This new chip carrier package uses Freescale Semiconductor’s unique sensor die with its piezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration.
NOTE: Freescale Semiconductor is also offering the Chip Pak...

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