New Product
MUH1PB thru MUH1PD
Vishay General Semiconductor
Surface Mount Ultrafast Rectifiers
FEATURES
eSMP TM Series
• Very low profile - typical height of 0.
65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward
voltage drop, low leakage current • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
Top View
Bottom View
MicroSMP
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr VF at IF = 1.
0 A IR TJ max.
1.
0 A 100 V, 150 V, 200 V 10 A 25 ns 0.
82 V 1 µA 175 °C
• Solder dip 265 °C max.
10 s, per JESD 22-A111 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according...