NP352 Series (Open Top) Fine Ball Grid Array (FBGA, 1.
00mm Pitch)
Specifications
Insulation Resistance:
1,000MW min.
at 100V DC
Dielectric Withstanding
Voltage: 100V AC for 1 minute
Contact Resistance:
100mW max.
at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C / -55°C to +150°C
Contact Force:
15g per pin approx.
Mating Cycles:
10,000 insertions minimun
Part Number (Details) NP352 - 560 09 - * - *
Series No.
No.
of Contact Pins
Design Number
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel
Mark for Positioning Pins
Contact Terminal Lengths and Form
Fea...