R8C/22 Group, R8C/23 Group
RENESAS MCU
REJ03B0097-0200 Rev.
2.
00
Aug 20, 2008
1.
Overview
This MCU is built using the high-performance silicon gate
CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP.
This MCU operates using sophisticated instructions featuring a high level of instruction efficiency.
With 1 Mbyte of address space, it is capable of executing instructions at high speed.
This MCU is equipped with one CAN module and suited to in-vehicle or FA networking.
Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group.
The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash.
Their peripheral functions ...