Preliminary SIDC08D120F6 Fast switching diode chip in EMCON-Technology FEATURES: • 1200V EMCON technology 120 µm chip • soft, fast switching This chip is used for: • EUPEC power modules and discrete devices A • low reverse recovery charge • small temperature coefficient Applications: C • SMPS, resonant applications, drives Chip Type SIDC08D120F6 VR IF 1200V 7A Die Size 2.
2 x 3.
7 mm2 Package Ordering Code sawn on foil Q67050-A4169A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Anode metallisation Cathode metallisation Die bond Wire bond Reject Ink Dot Size Recom...

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